data brief for further information contact your local stmicroelectronics sales office. june 2010 doc id 17209 rev 2 1/4 3 VD5376 ultra-low power motion sensor for optical finger navigation (ofn) and optical/laser mice features ultra-low power performance and high speed/high accuracy motion detection (1 m/s, 20 g) optional on-chip power management scheme (run/idle1/idle2/sleep) very low quiescent and operating current mode for battery life saving cpi programmable up to 3,200 cpi on-chip boost-converter controller enables a complete autonomous single aa/aaa-type battery supply application i 2 c interface, with fast polling rate capability for high end applications (report rate up to 1 per millisecond) internal oscillator on-chip adc for battery level reporting laser drive circuitry, fault detection scheme and safety features versatile usage: the sensor is designed to operate with a companion microcontroller, and can be used for any laser/led mouse system minimal external component requirement miniature die enabling smallest modules module design support description this device is intended to fit into any two-chip applications (companion mcu) and offers the best compromise between application cost, power and performance. it is ideally suited to meet requirements of the growing number of devices using finger navigation as an easy and intuitive human interface method. dgnd 1v8 int pad1 pad21 dgnd 100nf 1v8 int pad10 pad11 dgnd 100nf scl motion 2.2uf vsupply dgnd 12k ir led dgnd dgnd sda 33pf 2 vgate_on VD5376 pixel array: 20 x 20 pixel size:30.4um array size: 608um x 608um 17 test_clock 3 vref 4 vbat 5 vgate_start 21 avss 6 laser_out 7 rbin 8 laser_nen 20 dvss1 15 sda 9 reset_out 14 scl 11 dvss2 10 dvdd2 13 motion 12 rc_osc 19 vreg 16 powerdown 1 avdd 18 vtop n/c powerdown 1v8 internal regulated supply vsupply www.st.com www..net
VD5376 2/4 doc id 17209 rev 2 applications ofn applications for mobile phones, remote controls and portable electronic equipment ultra-low power wireless laser mouse: 27 mhz, 2.4 ghz and bluetooth suitable for laser usb mouse applications technical specifications silicon specifications figure 1. VD5376 die table 1. technical specifications resolution programmable up to 3200 cpi pixel size 30.4 m array size 20 x 20 pixels frame rate up to 4000 fps tracking performance laser or led : 1m/s very low drift supply voltage 1v to 1.6v (1) , 1.8v direct drive or 2.2v to 3.0v 1. using internal boost converter controller. operating temperature -20c to 60c table 2. silicon specifications wafer thickness 775 m, 375 m or 180 m (all +/- 20 m ) bond pad size 81 x 81 m minimum bond pitch 140 m
revision history VD5376 3/4 doc id 17209 rev 2 ordering information revision history table 3. ordering information order code description VD5376/uw unsawn wafer - 775 m VD5376ca/sw sawn wafer - 375 m VD5376cb/uw unsawn wafer - 180 m stv-376-e04 generic testboard date revision changes 2-mar-2010 1 initial release. 14-jun-2010 2 amendments made to data in table 1: technical specifications , table 2: silicon specifications to correct errors. new order codes added to table 3: ordering information .
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